Sapphire ceramic has very good mechanical properties, with high bending and compressive strength. According to market research data, the bending strength of sapphire ceramics can reach more than 500MPa, and the compressive strength can reach more than 2GPa. These excellent mechanical properties can ensure the stability and reliability of the device during manufacturing and use.
Sapphire ceramic substrate has very good high-temperature stability and can maintain stable performance in high-temperature environments. According to market research data, the operating temperature of sapphire ceramics can reach over 2000°C, and its thermal conductivity is very high, which can effectively improve the heat dissipation effect of the device.
Sapphire has very high corrosion resistance and can maintain stable performance in harsh environments such as acids, alkalis and high temperatures. According to market research data, sapphire ceramics have very good chemical stability and can be used in a variety of chemical media for a long time without being affected.
Compared with other materials, sapphire ceramics have better performance and stability and can meet the needs for high precision, high stability, high corrosion resistance and high temperature stability in MEMS device manufacturing. In contrast, traditional glass and quartz substrates are easily affected by mechanical properties. At the same time, their thermal expansion coefficients are large and prone to thermal stress, which affects the stability and reliability of the device.
Properties of Sapphire Ceramics
| Chemical Properties | Non-porous2.Unaffected by weatheringUnaffected by hydrationVirtually unaffected by any solvents or acids at room temperature | |
| Thermal Properties | ||
| Melting Point | 2053°C | |
| Maximum Using Temperature | 1800°C | |
| Thermal Conductivity | 40 W/M°K @ 298°K | |
| Expension @ 25°C | 4.5×10-6/K-1 and @ 1000°C: 9.0×10-6/K-1 (90° orientation) | |
| Specific Heat Capacity | 750 J/K at 300°K | |
| Viscosity @ 2053°C | 0.0584 Pa•s | |
| Physical Properties | ||
| Density | 3.98 g/cm3, (0.143 lbs./in3) | |
| Hardness | Knoop microindenter: 1800 FACE perpendicular to c-axis, 2200 FACE parallel to c-axis | |
| Young’s Modulus | 400 GPa @ 20°C | |
| Tensile Strength | 300 to 400 MPa | |
| Point Group; Symmetry | 3 2/m; [C,1A3, 3A2, 3P] | |
| Lattice Dimensions | a = 4.748 Angstroms, c = 12.957 Angstroms | |
| Sound Speed | ~10 km/s | |
