Metallized Ceramic substrate is a special process which copper directly bonded to the ceramic substrate surface at high temperature. The metallized ceramic substrate has the properties of excellent electrical insulation, high thermal conductivity, excellent solderability and high adhesion strength. It can be etched with various patterns like PCB boards.
Major features:
High strength
High thermal conductivity
High insulation
Anti-corrosion
Good thermal cycle performance
The operation temperature range is -55℃～850℃. The thermal expansion coefficient is close to silicon.
Ceramic Substrate material :
Aluminium Oxide (Al2O3)
Beryllium Oxide (BeO)
Aluminium Nitride (ALN)
Prodution Types:
HTCC (High-temperature Co-fired Ceramic)
LTCC （Low-Temperature Co-fired Ceramic）
DBC (Direct Bonded Copper)
DPC (Direct Plated Copper)
Applications:
High-power semiconductor modules
Semiconductor refrigerators
Electronic heaters
Power control circuits
Power hybrid circuits
Intelligent power components
High-frequency switching power
Relays
Automotive Electronics
Etcs
