Aluminium nitride (AlN) is a highly useful material thanks to its unmatched thermal conductivity, while simultaneously being attractive for its high electrical insulation properties, which do not attenuate even at high temperatures. Aluminium nitride also has good mechanical properties.
We have a range of different moulding methods for aluminium nitride. This allows us to manufacture components by uniaxial pressing, isostatic pressing, and also in the form of substrates.
Material Specifications:
Properties | Item | Unit | ALN-170 | ALN-200 | ALN-230 |
Basic Property | Color |
| Light cyan, Grayish white | Beige | Beige |
Density | g/cm3 | 3.3 | 3.3. | 3.3 | |
Surface Roughness | um | 0.2-0.6 | 0.2-0.75 | 0.2-0.75 | |
Camber | (length ‰) | <=3 | <=3 | <=3 | |
Thermal Properties | Thermal Conductivity | W/m.K | 170 | 200 | 230 |
Heat Conductivity | (10-6/℃) (20℃-800℃) | 4-6 | 4-6 | 4-6 | |
Mechanical Properties | Bending Strength | Mpa | >=400 | >=350 | >=350 |
Electrical Properties | Dielectric Constant | 1MHz | 8-9 | 8-9 | 8-9 |
Dielectric Strength | KV/mm | >=17 | >=17 | >=17 | |
Volume Resistivity | 20℃ Ʊ.Cm | >=1014 | >=1014 | >=1014 |
Applications:
The substrate are widely used in ceramic metallization such as DPC(Direct Plate Copper). Thin film supttering, AMB(Active Metal Brazing), Thick film printing etc.,.
After applying these metallization, they are using in high power LED industry, RF resistance applications, and high-power IGBT module applications.